Semicon 2.0 Could Boost Indigenous Chip Design for India’s 5G and 6G Telecom Infrastructure
India Electronics and Semiconductor Association President Ashok Chandak has called for stronger domestic chip design capabilities and growth funding for SMEs, saying Semicon 2.0 could support indigenous semiconductor IP for India’s 5G and 6G telecom infrastructure.
India needs to strengthen its domestic semiconductor design capabilities for telecommunications infrastructure and provide growth capital to small and medium enterprises (SMEs) to help them scale up and compete globally, according to Ashok Chandak, President of the India Electronics and Semiconductor Association (IESA) and President and CEO of SEMI India. Speaking in Bengaluru on October 9, Chandak said India’s telecom infrastructure continues to depend significantly on imported components, while locally designed chips for the sector remain limited.
Chandak said the proposed Semicon 2.0 programme could encourage Indian companies to develop chips and indigenous intellectual property tailored to the requirements of telecom networks. Such capabilities would be relevant to next-generation infrastructure, including 5G and 6G systems, where specialised semiconductor components support network processing, connectivity and performance. Understanding the technical specifications and requirements of telecom equipment will be important for developing solutions suited to domestic needs.
He also highlighted the complementary roles of India Mobile Congress and SEMICON India in developing the country’s technology ecosystem. India Mobile Congress focuses primarily on telecommunications infrastructure, equipment and deployment, while SEMICON India addresses the broader semiconductor value chain, from chip design to manufacturing. Greater coordination between these areas could help connect domestic semiconductor development with the practical requirements of telecom equipment makers and network operators.
Semicon 2.0 aims to expand India’s semiconductor capabilities across chip design, manufacturing equipment, materials, fabrication, advanced packaging, research and talent development. For domestic chip designers and SMEs, access to capital, design tools and industry partnerships will be important to move from development to commercial deployment. Building indigenous semiconductor IP for telecom infrastructure could help increase domestic value addition, reduce dependence on imported technology and strengthen India’s position in the global electronics supply chain.
