GaN Epitaxial Wafers
2-inch Epitaxial GaN-on-sapphire HEMT Wafer
AGAH2C25S by Agnit Semiconductors
The AGAH2C25S from Agnit Semiconductors is a 2-inch MOCVD-grown epitaxial GaN-on-sapphire HEMT wafer for high-frequency rf devices; strategic and telecommunication applications. Its material-characteristics table specifies sheet resistance ≤400 Ω/sq, sheet carrier density ≥9 × 10^12 cm^-2 and electron mobility ≥1700 cm²/Vs. The wafer uses 2-inch c-plane sapphire SSP. Layer materials, grouped thickness values and wafer dimensions are retained in the specifications below. RF applicability statements are not an operating-frequency rating. Source: Agnit AGAH2C25S datasheet, Version 2.0 December 2024, pages 1–3.
Specifications
| Parameter | Min | Typ | Max | Unit | Value / Conditions |
|---|---|---|---|---|---|
| Material / substrate | — | — | — | — | GaN-on-sapphire; 2-inch c-plane sapphire SSP |
| Nominal wafer diameter | — | — | — | inch | 2-inch nominal |
| Sheet resistance | — | — | — | Ω/sq | ≤400 Ω/sq |
| Sheet carrier density | — | — | — | cm^-2 | ≥9 × 10^12 cm^-2 |
| Electron mobility | — | — | — | cm²/Vs | ≥1700 cm²/Vs |
| Wafer bow | — | — | — | µm | ≤±15 µm (source notation) |
| GaN FWHM (002) | — | — | — | arc secs | ≤300 arc secs; (002) |
| GaN FWHM (102 / 103) | — | — | — | arc secs | ≤450 arc secs; (103) |
| Surface roughness | — | — | — | nm | ≤0.4 nm |
| Buffer breakdown | — | — | — | V | Not specified as a buffer-breakdown table rating. |
| Cap layer | — | — | — | — | SiNₓ; 3 nm; thickness can be modified upon request up to 5 nm. |
| Barrier layer | — | — | — | — | Al₀.₂₅Ga₀.₇₅N; 18 ± 1 nm; barrier thickness can be modified on request. |
| Interlayer / spacer | — | — | — | — | AlN; 1 nm; schematic labels this AlN Spacer. |
| Channel / buffer / nucleation stack | — | — | — | — | GaN channel → C:doped GaN buffer → AlN nucleation; Table 2 shared thickness cell: 2 ± 0.1 µm across these rows; thickness and dopant can be modified on request. |
| Strain relief layers | — | — | — | — | Not separately specified. |
| Substrate thickness | — | — | — | — | 450 µm ± 25 µm |
| Wafer dimensions / flats | — | — | — | — | Diameter 50.8 ± 0.38 mm; primary flat shown, length not specified. |
| Source-supported features | — | — | — | — | Device and material quality and uniformity; buffer designed to minimize current collapse; reduced wafer warpage for tool compatibility. Supports highly-scaled, high-frequency RF devices. |
| Source-supported applications | — | — | — | — | High-frequency RF devices; strategic and telecommunication applications |
| Source notes | — | — | — | — | Table 1 uses inclusive limits (≤ / ≥), while introductory prose uses less than / greater than; Table 1 limits are retained. No RF operating-frequency range is specified. Shared Table 2 thickness cells are retained as grouped stack values, without assigning a separate thickness to each layer. Source inconsistency: the sapphire substrate comment says “Si face epi-ready.” Retained here only as a source note; the substrate identity remains c-plane sapphire SSP. |
| Datasheet revision | — | — | — | — | Version 2.0 December 2024; pages 1–3 |
Applications
Technology
Taxonomy
Package: Epitaxial wafer
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