RF Power Transistors
45 W RF Power GaN HEMT
AG28S45F by Agnit Semiconductors
The AG28S45F from Agnit Semiconductors is a 45 W GaN-on-SiC RF power HEMT die for communications, avionics and radar applications. Its operating range is DC–2.4 GHz with a 28 V drain bias. Source device details: 15 mm device; packaged die schematic: 4 × 1 mm. At 2.4 GHz and Tc = 25 °C, Table 2 specifies 45 W typical saturated output and 52 W maximum, 9 dB typical power gain at Psat and 52% typical drain efficiency (56% maximum). The saturated-power bias is VDD = 28 V, IDQ = 400 mA. Separate pulsed load-pull measurements at 2.4 GHz in deep Class-AB operation (VDS,Q = 28 V; IDS,Q = 400 mA) report 52 W output at 3 dB compression, 10.6 dB gain and 56% drain efficiency. These are condition-specific measured results, separate from the rated electrical characteristics. Small-signal S-parameters are available on request. Table 1 absolute maximum ratings: drain-source voltage 100 V; gate-source voltage -10, 0.0 V; maximum forward gate current 15 mA; maximum drain current 12 A (each with 25 °C condition). Storage temperature is printed as a single 25 °C value, not a range. Operating junction temperature is unspecified (dashes). No temperature range or missing rating is inferred. Table 2 drain-current maximum exceeds Table 1 maximum drain current; both values and their distinct conditions are retained. Source inconsistency: Table 2 gate-quiescent voltage condition specifies VDD = 50 V, IDQ = 400 mA, while the headline drain bias, RF saturated-power condition and pulsed load-pull bias are 28 V. The printed 50 V test condition is preserved without correction. Source: Agnit AG28S45F datasheet, Rev. 2.0, February 2026, pages 1–3.
Specifications
| Parameter | Min | Typ | Max | Unit | Value / Conditions |
|---|---|---|---|---|---|
| Operating frequency | — | — | — | GHz | DC–2.4 GHz |
| Drain bias | — | — | — | V | 28 V drain bias |
| Saturated output power | — | 45 | 52 | W | 45 W typical; 52 W maximum; F = 2.4 GHz, Tc = 25 °C; VDD = 28 V, IDQ = 400 mA |
| Power gain at Psat | — | 9 | — | db | 9 db typical; Power Gain @ Psat; F = 2.4 GHz, Tc = 25 °C |
| Drain efficiency | — | 52 | 56 | % | 52% typical; 56% maximum; F = 2.4 GHz, Tc = 25 °C |
| Drain-source breakdown voltage | — | 100 | — | V | 100 V typical; VGS = -6 V, ID = 15 mA; F = 2.4 GHz, Tc = 25 °C |
| Gate threshold voltage | -4.3 | -4.1 | -3.8 | V | Min / Typ / Max: -4.3 / -4.1 / -3.8 V; VDS = 10 V, ID = 15 mA; F = 2.4 GHz, Tc = 25 °C |
| Gate quiescent voltage | -4.1 | -3.9 | -3.7 | V | Min / Typ / Max: -4.1 / -3.9 / -3.7 V; VDD = 50 V, IDQ = 400 mA; F = 2.4 GHz, Tc = 25 °C; SOURCE INCONSISTENCY: printed 50 V differs from 28 V device bias |
| Drain current | 11.5 | 12 | 12.5 | A | Min / Typ / Max: 11.5 / 12 / 12.5 A; VDS = 10 V, VGS = 0 V; F = 2.4 GHz, Tc = 25 °C |
| Technology | — | — | — | — | GaN-on-SiC HEMT |
| Device form | — | — | — | — | GaN-on-SiC HEMT die; packaged die schematic; 15 mm device; packaged die schematic: 4 × 1 mm |
| Pulsed load-pull output at 3 dB compression | — | — | — | W | 52 W at 3 dB compression; Measured pulsed load-pull; 2.4 GHz, deep Class-AB; VDS,Q = 28 V; IDS,Q = 400 mA |
| Pulsed load-pull power gain | — | — | — | dB | 10.6 dB; Measured pulsed load-pull; 2.4 GHz, deep Class-AB; VDS,Q = 28 V; IDS,Q = 400 mA |
| Pulsed load-pull drain efficiency | — | — | — | % | 56%; Measured pulsed load-pull; 2.4 GHz, deep Class-AB; VDS,Q = 28 V; IDS,Q = 400 mA |
| Small-signal S-parameters | — | — | — | — | Small-signal S-parameters available on request |
Applications
Technology
Taxonomy
Package: Die
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